Abrasive Device

ABSTRACT

An abrasive device including at least one substrate, provided as a carrier element of a binder layer at least partially accommodating at least one abrasive grain, and having at least one fastening element, configured to detachably fasten the at least one substrate to an abrasive handling device.

This application claims priority under 35 U.S.C. §119 to patentapplication no. DE 10 2013 203 116.5, filed on Feb. 26, 2013 in Germany,the disclosure of which is incorporated herein by reference in itsentirety.

BACKGROUND

The present disclosure relates to an abrasive device. An abrasivedevice, which has a substrate provided as a carrier element of a binderlayer accommodating at least one abrasive grain and which has afastening element, arranged on the substrate, for detachable fasteningof the substrate to an abrasive handling device, is already known fromEP 0 779 851 B1. The fastening element is there configured as aVelcro-type element or the like, by means of which the abrasive devicecan be fastened by a Velcro-type connection detachably to an abrasivehandling device configured as a grinding disk.

SUMMARY

The disclosure describes an abrasive device, in particular a foamabrasive device, having at least one substrate, provided as a carrierelement of a binder layer accommodating at least one abrasive grain, andhaving at least one fastening element, arranged on the substrate, fordetachable fastening at least of the substrate to an abrasive handlingdevice.

It is proposed that the fastening element is configured as an adhesionfastening element. The abrasive device can here be configured as agrinding wheel or as a grinding belt. The fastening element is herepreferably connected integrally to the substrate. It is alsoconceivable, however, for the fastening element to be additionally oralternatively fixed to the substrate by means of a non-positive and/orby means of a positive connection. Particularly preferably, the abrasivedevice thus comprises at least one abrasive grain and at least onebinder layer, in which the abrasive grain is at least partiallyarranged. The binder layer is preferably fixed to the substrate by meansof an integrally bonded joint. All in all, the abrasive devicepreferably comprises a multiplicity of abrasive grains, which arearranged at least partially in the binder layer. To this end, the binderlayer preferably comprises at least one base binder, which connects theabrasive grains integrally to the substrate. It is also conceivable forthe binder layer to have, in addition to the base binder, at least afirst top binder, which is applied to the base binder. Furthermore, itis likewise conceivable for the binder layer to have, in addition to thebase binder and to the first top binder, a second top binder, which isapplied to the first top binder. The base binder, the first top binderand the second top binder can here have any forms which appear sensibleto a person skilled in the art, such as, for example, forms made ofsynthetic resin (epoxide, urea resin, melamine resin, unsaturatedpolyester resin, etc.) etc. Furthermore, the first top binder and thesecond top binder can comprise further active substances and/or fillerswhich appear sensible to a person skilled in the art.

The abrasive grain or grains of the abrasive device can be formed of amineral and/or of a ceramic material, such as, for example, of diamond,of corundum, of emery, of garnet, of grindstone, of chert, of quartz, ofsandstone, of chalcedony, of flint, of quartzite, of silicate material,of feldspar, of pumice, of talcum, or boron carbide, of cubic boronnitride, of fused corundum, of ceramic aluminum oxide, of aluminumzirconium oxide, of glass, of silicon carbide, of iron oxide, oftantalum carbide, of cerium oxide, of tin oxide, of titanium carbide, ofmanganese dioxide, of zirconium oxide, of silicon nitride, etc. Theabrasive grain or grains can here have any geometric form which appearssensible to a person skilled in the art, such as, for example,tetrahedral, truncated pyramid-shaped, triangular, cylindrical, etc. Theabrasive grain or grains of the abrasive device is/are here preferablyarranged, in a manner already known to a person skilled in the art, onand/or at least partially in the binder layer, such as, for example, bymeans of an electrostatic process, by means of a mechanical(gravimetric) process, etc.

The expression “detachably fastened” is here intended to define, inparticular, a fastening of at least two elements one to another, whichfastening is separable in a non-destructive manner, in particular isseparable without the use of tools. The fastening element is preferablydetachable from the abrasive handling device without leaving residues.The fastening element configured as an adhesion fastening element ispreferably configured as an adhesion layer. The fastening element herehas at least one adhesion surface, by means of which a detachablefastening of the substrate to an abrasive handling device can beachieved. The abrasive handling device can here be configured as agrinding disk, as a grinding block, as a manual grinding disk, etc. Bymeans of the inventive design of the abrasive device, a comfortablefastening of the substrate, and thus of the entire abrasive device, tothe abrasive handling device can advantageously be achieved. Moreover, auser-friendly exchange of the abrasive device can advantageously beachieved. Thus an operator can advantageously utilize an abrasivehandling device for different versions of abrasive devices according tothe disclosure.

It is further proposed that the fastening element is configured as acontact adhesive element. Thus the fastening element preferably has atleast one contact adhesive surface. The contact adhesive surfacepreferably extends over a total areal extent of the substrate and/or ofthe fastening element. It is also conceivable, however, for the contactadhesive surface of the fastening element to be arranged only at certainpoints on the substrate. By means of the inventive design, a compactfastening element can be achieved. Moreover, a fastening element ofsimple design can advantageously be realized.

It is further proposed that the fastening element is configured as apressure-sensitive contact adhesive element (PSA). By a“pressure-sensitive contact adhesive element” should here be understood,in particular, an adhesive element which is designed to produce, afteran arrangement of a glued surface of the adhesive element on an elementand a subsequent application of pressure to the adhesive element, abonded joint. By means of the inventive design of the fastening elementas a pressure-sensitive contact adhesive element, a high resistance ofthe fastening element to a shear load can advantageously be achieved.Thus a secure fastening to an abrasive handling device canadvantageously be achieved.

It is also proposed that the abrasive device comprises at least thebinder layer, which is arranged on a side of the substrate that isfacing away from the fastening element. The binder layer, viewed along adirection running at least substantially perpendicular to an abrasivesurface of the abrasive device, is arranged on a side of the substratethat is facing away from the fastening element. The expression“substantially perpendicular” is here intended to define, in particular,an orientation of a direction relative to a reference direction, whereinthe direction and the reference direction, in particular viewed in oneplane, form an angle of 90°, and the angle has a maximum deviation of,in particular, less than 8°, preferably less than 5°, and particularlyadvantageously less than 2°. The expression “abrasive surface of theabrasive device” should here be understood, in particular, a surface, inparticular a surface lying in an imaginary plane intersecting theabrasive grains arranged in and/or on the binder layer, which surface,during a grinding operation, touches a workpiece surface of a workpieceto be machined. By means of the inventive design, an incorrect assemblyof the abrasive device can advantageously be prevented.

It is further proposed that the substrate is formed of a foam. Thesubstrate can here be formed at least partially of polyurethane foam(PUR) or of ethylene vinyl acetate (EVA). Thus the abrasive device isconfigured particularly preferably as a foam grinding wheel. Preferably,the foam substrate is of flexible configuration. A particularlycomfortable machining on poorly accessible portions of workpieces to bemachined can hereby advantageously be enabled. Moreover, a shape of thebinder layer provided with abrasive grains can advantageously be adaptedto a contour of a workpiece to be machined. Thus a precise machining ofa workpiece to be machined can advantageously be enabled.

It is further proposed that the substrate is formed of an open-porefoam. The substrate is here preferably formed at least partially ofpolyurethane foam (PUR). As a result, a particularly flexible substratecan advantageously be realized. Moreover, a low-weight abrasive devicecan advantageously be realized.

It is also proposed that the abrasive device has at least one suctioncavity, which is introduced at least into the substrate. The suctioncavity, viewed along a direction running at least substantially parallelto the abrasive surface of the abrasive device, here has a greaterextent than pores of the foam substrate. By “substantially parallel”should here be understood, in particular, an orientation of a directionrelative to a reference direction, in particular in one plane, whereinthe direction has in relation to the reference direction a deviation, inparticular, less than 8°, advantageously less than 5°, and particularlyadvantageously less than 2°. By means of the inventive design, anextraction of removed workpiece particles of a workpiece to be machinedcan advantageously be enabled. Thus a high ease of use for an operatorcan advantageously be created.

It is further proposed that the suction cavity extends through thesubstrate and the fastening element. The suction cavity, viewed alongthe direction running at least substantially perpendicular to theabrasive surface, preferably extends through the whole of the abrasivedevice. Thus the suction cavity, viewed along the direction running atleast substantially perpendicular to the abrasive surface, extendsthrough the binder layer, the substrate and the fastening element. Ahigh extraction output of removed workpiece particles can advantageouslybe enabled. Thus a clogging of the abrasive grains with removedworkpiece particles can advantageously be avoided.

It is further proposed that the substrate has a maximum thickness ofmore than 1 mm. The substrate preferably has a maximum thickness of morethan 2 mm, and particularly preferably of more than 5 mm. Thus a stableabrasive device can advantageously be achieved.

In addition, a method is described for producing the abrasive deviceaccording to the disclosure. By means of the method according to thedisclosure, a cost-effective abrasive device, which can comfortably befastened to an abrasive handling device, can advantageously be realized.

The abrasive device according to the disclosure and/or the methodaccording to the disclosure should not here be limited to theabove-described application and embodiment. In particular, the abrasivedevice according to the disclosure, and/or the method according to thedisclosure for implementing a mode of operation described herein, canhave a number deviating from a herein stated number of individualelements, components and units, as well as method steps.

Further advantages emerge from the following detailed description. Inthe FIGURE, an illustrative embodiment of the disclosure is represented.The FIGURE, the detailed description, and the claims contain numerousfeatures in combination. A person skilled in the art will alsoexpediently view the features individually and combine them intosensible further combinations.

BRIEF DESCRIPTION OF THE DRAWINGS

The FIGURE shows a detailed view of a portion of an abrasive device in aschematic representation.

DETAILED DESCRIPTION

The FIGURE shows an abrasive device 10, which has at least one substrate12 provided as a carrier element of a binder layer 16 at least partiallyaccommodating at least one abrasive grain 14. The substrate 12 is formedof a foam. The substrate 12 is here formed of an open-pore foam, suchas, for example, of a polyurethane foam (PUR). It is also conceivable,however, for the substrate 12, in an alternative form (not representedhere), to be formed of a closed-pore foam, such as, for example, of anethylene vinyl acetate foam (EVA). The substrate 12 formed of foam thuscomprises pores 24, which are arranged within the foam. The pores 24 arehere configured as air pockets within the substrate 12. The abrasivedevice 10 is thus configured as a foam abrasive device, which has aplastics substrate carrier element on which at least the binder layer 16at least partially accommodating the at least one abrasive grain 14 isarranged. The substrate 12 has a disk-shaped form. Thus the abrasivedevice 10 is configured as a foam grinding wheel device. The substrate12, viewed along a direction running at least substantiallyperpendicular to an abrasive surface of the abrasive device 10, furtherhas a maximum thickness of more than 1 mm. It is also conceivable,however, for the substrate 12 to have a different geometric shape whichappears sensible to a person skilled in the art, such as, for example, apolygonal shape, an elliptical shape, a circular-segment-like shape,etc., which has a thickness deviating from a thickness greater than 1mm.

Furthermore, the abrasive device 10 comprises at least one fasteningelement 18 for a detachable fastening at least of the substrate 12 to anabrasive handling device (not represented in detail here). The abrasivehandling device can here be configured as a grinding disk arranged on atool holder of a portable machine tool (not represented in detail here),as a grinding block, as a manual grinding disk, etc. The fasteningelement 18 is fixed to the substrate 12 by means of an integrally bondedjoint. The fastening element 18 is here fixed to the substrate 12 bymeans of a bonding process. It is also conceivable, however, for thefastening element 18 to be fixed to the substrate 12 by means of adifferent method which appears sensible to a person skilled in the art.

The abrasive device 10 further comprises at least the binder layer 16and a multiplicity of abrasive grains 14 arranged in and/or on thebinder layer. The binder layer 16 is fixed to the substrate 12 by meansof an integrally bonded joint. The binder layer 16, viewed along thedirection running at least substantially perpendicular to the abrasivesurface of the abrasive device 10, is here arranged on a side 20 of thesubstrate 12 that is facing away from the fastening element 18. Theabrasive grains 14 are fixed by means of a base binder of the binderlayer 16, in a manner which is already known to a person skilled in theart, integrally in and/or on the binder layer 16. Portions of theabrasive grains 14 here project out of the binder layer 16, in a mannerwhich is already known to a person skilled in the art, for materialremoval during a grinding operation. The binder layer 16 also comprises,in addition to the base binder, at least a first top binder, which isapplied to the base binder. Furthermore, it is likewise conceivable forthe binder layer 16 to have, in addition to the base binder and to thefirst top binder, a second top binder, which is applied to the first topbinder. The base binder, the first top binder and the second top binder,starting from the substrate 12 and viewed in a direction directed awayfrom the substrate 12, are here arranged in the following order:directly contiguous to the substrate 12 is arranged the base binder,after which follows the first top binder and then the second top binder.The base binder, the first top binder and the second top binder arerespectively connected to one another in an integrally bonded manner.Further binders or constituent substances of the binder layer whichappear sensible to a person skilled in the art are likewise conceivable.By means of the binder layer 16, the abrasive grains 14 are thus fixedto the substrate 12 by means of an integrally bonded joint.

In order to enable an extraction of removed workpiece particles during agrinding operation, the abrasive device 10 has at least one suctioncavity 22 (shown in dashed representation in the FIGURE), which isintroduced at least into the substrate 12. The suction cavity 22 extendsat least through the substrate 12 and the fastening element 18. Thesuction cavity 22, viewed along the direction running at leastsubstantially perpendicular to the abrasive surface of the abrasivedevice 10, here extends up to a surrounding boundary layer which closesoff the binder layer 16. All in all, the abrasive device 10 comprises amultiplicity of suction cavities 22, which, if the abrasive device 10 isarranged on a grinding disk connected to a tool holder of a portablemachine tool or on a wheel stand, which grinding disk or wheel stand isconnected to a suction unit (not represented in detail here), areprovided to enable an extraction of removed workpiece particles.

The abrasive device 10 can here be detachably arranged on the abrasivehandling device. To this end, the fastening element 18 is configured asan adhesion fastening element. The fastening element 18 is hereconfigured as a pressure-sensitive contact adhesive element. Thefastening element 18 has at least one contact adhesive surface 30, bymeans of which the fastening element 18, and thus the abrasive device10, can be detachably arranged on the abrasive handling device. Thus theabrasive device 10, following usage, can be pulled off from the abrasivehandling device, in particular can be pulled off at least substantiallywithout leaving residues. The fastening element 18, viewed along thedirection running at least substantially perpendicular to the abrasivesurface of the abrasive device 10, is arranged on the substrate 12 on aside 26 of the substrate 12 that is facing away from the binder layer16. The fastening element 18 is here configured as a contact adhesivelayer, which extends over the entire side 26 of the substrate 12 that isfacing away from the binder layer. It is also conceivable, however, forthe fastening element 18 to be arranged, distributed at certain points,on that side 26 of the substrate 12 that is facing away from the binderlayer. For protection of the fastening element 18 from contaminationprior to use, the abrasive device 10 has at least one protective element28. The protective element 28 is configured as a protective film, whichis applied to the fastening element 18. Thus the protective element 28,before the abrasive device 10 is arranged on an abrasive handlingdevice, is peeled off from the fastening element 18 by an operator toenable the fastening element 18, and thus the abrasive device 10, to bebonded to an abrasive handling device.

For production of the abrasive device 10, in a method step of a methodfor producing the abrasive device 10, the binder layer 16 is connectedto the substrate. A base binder layer of the binder layer is hereapplied to the substrate 12. In a further method step of the method, theabrasive grains 14 are applied to and/or introduced into the binderlayer 16. In a further method step of the method, it is here possiblefor a first top binder to be applied to the abrasive grains 14 arrangedin and/or on the binder layer 16. It is also conceivable for a secondtop binder to be applied in a further method step of the method.

Furthermore, in a further method step, the fastening element 18 isapplied to that side 26 of the substrate 12 that is facing away from thebinder layer 16. After the fastening element 18 has been applied to thesubstrate 12, the protective element 28 is connected to the fasteningelement 18. It is also conceivable, however, for the protective element28 to be already arranged on the fastening element 18 before thefastening element 18 is applied to that side 26 of the substrate 12 thatis facing away from the binder layer 16. The fastening element 18 can inthis case be applied to the substrate 12 as liquid film, which at leastpartially solidifies after a drying operation, or the fastening element18 is configured as a flexible contact adhesive film, which is fixed tothe substrate by means of a bonding process. Further forms of thefastening element 18 which appear sensible to a person skilled in theart are likewise conceivable.

What is claimed is:
 1. An abrasive device comprising: a binder layerconfigured to at least partially accommodate at least one abrasivegrain; at least one substrate including a carrier element of the binderlayer; and at least one adhesion fastening element configured todetachably fasten the at least one substrate to an abrasive handlingdevice.
 2. The abrasive device of claim 1, wherein the at least oneadhesion fastening element is configured as a contact adhesive element.3. The abrasive device of claim 1, wherein the at least one adhesionfastening element is configured as a pressure-sensitive contact adhesiveelement.
 4. The abrasive device of claim 1, wherein the binder layer islocated on a side of the at least one substrate that is facing away fromthe at least one adhesion fastening element.
 5. The abrasive device ofclaim 1, wherein the at least one substrate is formed of a foam.
 6. Theabrasive device of claim 1, wherein the at least one substrate is formedof an open-pore foam.
 7. The abrasive device of claim 1, furthercomprising: at least one suction cavity which is introduced at leastinto the at least one substrate.
 8. The abrasive device of claim 7,wherein the suction cavity extends through the at least one substrateand the at least one adhesion fastening element.
 9. The abrasive deviceof claim 1, wherein the at least one substrate has a maximum thicknessof more than 1 mm.
 10. A method of producing an abrasive device,comprising: supporting a binder layer with a substrate; applyingabrasive grains to the binder layer; and applying an adhesion fasteningelement to the substrate, the adhesion fastening element configured todetachably fasten the substrate to an abrasive handling device.